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End-Use Case Study —

Electronic Book Enclosure

  • EMI Shielding Material is Cost-Saving, Effective
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An electronic book by IBM of Rochester, Minnesota which utilizes an RTP Company material, took top honors in Plastics Industry News magazine's Computer & Business Equipment Category. An enclosure for software modules, the electronic book is designed for use with the IBM AS400 mini-computer.

Initially made with magnesium, the new material is an RTP Company polycarbonate/ABS alloy modified with nickel-coated carbon fibers. The material meets IBM's primary requirements by providing EMI/RFI shielding and remaining cost-effective.

The enclosure, manufactured with a coinjection process instead of a standard injection-molding process, produces a cost-savings of 25%. It also does not need plating, painting or coating due to the EMI/RFI shielding provided by the new material.

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