Innovation Bulletin —
Electronic Encapsulation Compounds
![[cover shot]](ec2.gif)
- Replace thermosets and expensive ceramics
- Improve design freedom
- Reduce or eliminate secondary operation costs
- Choose laser markable and/or commercial colors
RTP Company's Electronic Component Encapsulation Compounds (ec)2 are superior to thermosets and expensive ceramics in protecting sensitive microelectronic components from moisture and other environmental conditions. They improve thermal cycling performance and eliminate health and safety concerns.
Innovation Bulletin Download
A version of the Electronic Encapsulation Compounds innovation bulletin suitable for printing or saving is available as a PDF (Portable Document Format) file. PDF files require the Adobe Reader software for viewing.
Additional Information
- DATA SHEETS: Electronic Encapsulation Compounds
- PRESS RELEASE: RTP Company develops compounds for electronic component encapsulation
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Corporate Headquarters:
U.S. toll-free 1-800-433-4787 • Voice (507) 454-6900 • Fax (507) 454-2041
RTP Company • 580 East Front Street • Winona, MN, 55987, USA
Internet www.rtpcompany.com • E-mail rtp@rtpcompany.com
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