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Nanocomposite Compounds

Nanocomposite Compounds offer improved mechanical and thermal properties compared to neat resins. Their low loading levels (2-8%) increase stiffness with minimal impact on specific gravity. They feature excellent gas barrier properties (transmission rates improved by 2-4 times) and dramatic enhancements in heat distortion temperature (HDT).

Product Characteristics

  • Contains organically-treated, mica-like clay that separates into microscopic platelets and disperses evenly throughout resin
  • Stiffness comparable to a 20-30% load of a standard mineral filled compound
  • Low loading levels help maintain resin transparency
  • Available for injection molding, extrusion (sheet or film), and blow molding

Typical Applications

  • Food packaging
  • Cosmetics packaging
  • Electronics packaging
  • Blow molded bottles and containers
Innovation Bulletin Download

A version of the Nanocomposite Compounds innovation bulletin suitable for printing or saving is available as a PDF (Portable Document Format) file. PDF files require the Adobe Reader software for viewing