RTP Company Develops Compounds for Electronic Component Encapsulation

RTP Company, a global leader in specialty compounding, introduces Electronic Component Encapsulation Compounds—(ec)2. These thermoplastic compounds are superior to standard thermoset encapsulation grade materials in protecting sensitive microelectronic components from moisture and other environmental conditions. They’re ideal for packaging resistors, integrated circuits, capacitors, and fiber optic connectors.

(ec)2 compounds improve thermal conductivity, dissipating heat away from microelectronic components. They improve dielectric properties and have a lower coefficient of thermal expansion than thermoset materials for improved thermal cycling performance. Unlike thermosets, there are no environmental disposal or health and safety concerns.

These compounds are available in commercial colors and can be laser marked with characters, numerals, or other graphics.

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