Electronic Encapsulation Compounds Literature

Electronic EncapsulationInnovation Bulletin
  • Replace thermosets and expensive ceramics
  • Improve design freedom
  • Reduce or eliminate secondary operation costs
  • Choose laser markable and/or commercial colors

RTP Company’s Electronic Component Encapsulation Compounds (ec)2 are superior to thermosets and expensive ceramics in protecting sensitive microelectronic components from moisture and other environmental conditions. They improve thermal cycling performance and eliminate health and safety concerns.

Innovation Bulletin Download Download a print-friendly Electronic Encapsulation Compounds innovation bulletin in PDF format.

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