Modern automated wafer handling processes have increased the need for tighter tolerances on wafer carriers. Entegris, Inc., is the first company to make significant changes to the original linear wafer carriers developed in the early 1970's
Recent advances in tooling and equipment have made it possible to extrude high performance engineering thermoplastic compounds and alloys with precision approaching that of injection molding.
A PEEK™ compound, using the material's outstanding combination of strength, dimensional stability and inertness, is the material of choice for a scientific instrument application.
When Visteon Automotive Systems began manufacturing scroll compressors for automotive air conditioning systems, it chose a PEEK™-based specialty compound for the compressor's tip seals.