Modern automated wafer handling processes have increased the need for tighter tolerances on wafer carriers. Entegris, Inc., is the first company to make significant changes to the original linear wafer carriers developed in the early 1970's
Recent advances in tooling and equipment have made it possible to extrude high performance engineering thermoplastic compounds and alloys with precision approaching that of injection molding.
New, high-pressure aluminum compressed gas cylinders are finished in a rigorous washing, coating and curing system. The cylinders suspend from a conveyor by plug hooks that provide a grounding path for the powder coating.
A PEEK™ compound, using the material's outstanding combination of strength, dimensional stability and inertness, is the material of choice for a scientific instrument application.
AC Engineering has taken pump technology to a new level with the development of a sanitary disposable pump. AC solved these challenges with their scroll pump by incorporating high performance thermoplastics from RTP Company.
In some cases, small jobs demand enormous responses. When Accumold of Ankeny, IA, took on the design of a new capacitor housing for a leading hearing aid manufacturer, they faced and met many challenges.
In early 1997, a Xerox team was formed to identify a bushing material that extends design life, prevents customer dissatisfaction, and eliminates excessive service costs for a Xerox copier line.