Lead-Free Soldering Processes

Glass Reinforced High Temperature Compounds

Manufacturing techniques involving lead-bearing solders are under close scrutiny. Environmental concerns originating in Europe resulted in legislative directives calling for the elimination of certain substances deemed hazardous—including lead—from most electronic equipment starting July 2006.

The primary challenge in this transition is adapting to the higher temperatures that are required in the lead-free soldering process.

Impacted the most by this requirement are the thermoplastic materials in connectors and board level components such as capacitor housings and potentiometers.

High temperature thermoplastic technology has become a critical factor in product design. Components exposed to lead-free solder alloys must be capable of withstanding temperatures of 260 °C. Thermoplastic compounds that do not meet these requirements may melt or experience warpage.

Compatible Glass Reinforced Compounds

Resin Product
Description
HDT @
264 psi
Continuous Use
Temperature
Flammability
V-0 @ 1/32 in
°F °C °F °C Halogen Halogen-free
PPS RTP 1305 500 260 425 218 No Yes
PEEK RTP 2205 HF 600 316 475 246 No Yes
LCP RTP 3405-3 530 277 450 232 No Yes
LCP RTP 3405-4 585 307 450 232 No Yes
PPA RTP 4005 FR A HS 500 260 375 191 Yes No
HTN RTP 4405 FR 500 260 300 149 Yes No

High temperature compounds from RTP Company can be custom formulated to meet the requirements of individual applications and special manufacturing processes.

In additional to improved heat deflection temperatures and flammability protection, high temperature compounds can provide exceptional chemical, wear, and abrasion resistance. Also, they can employ various identification technologies, such as industrial coloring or microtaggants.